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Proceedings Paper

Profile measurement for printed wiring boards
Author(s): Moritoshi Ando; Hiroshi Oka
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Paper Abstract

We developed pattern inspection techniques for simultaneously measuring both the width and the thickness of conductive patterns printed on ceramic green sheets. The measuring optics use a He-Ne laser scanner. Thickness is measured by beam splitting, and width, by light diffusion. The beam-splitting optics measure the height by determining the ratio of reflected to transmitted light intensity. By optimizing the arrangement of the optics, we attain a resolution of 5 im and a height measurement range of [70 pm. Pattern width measurement is based on the fact that a beam of light diffuses when it strikes the substrate, but does not diffuse when it strikes the conductive pattern. A spatial ifiter in the focal plane raises the S/N ratio to four regardless of the state of the conductor surface. We used these techniques to inspect the conductive patterns on green sheets. Our system inspects conductor patterns 3-dimensionally at 12 Mplxels per second with a 5 i.m resolution.

Paper Details

Date Published: 1 August 1990
PDF: 8 pages
Proc. SPIE 1265, Industrial Inspection II, (1 August 1990); doi: 10.1117/12.20240
Show Author Affiliations
Moritoshi Ando, Fujitsu Labs. Ltd., Atsugi (Japan)
Hiroshi Oka, Fujitsu Labs. Ltd., Atsugi (Japan)


Published in SPIE Proceedings Vol. 1265:
Industrial Inspection II
Donald W. Braggins, Editor(s)

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