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Proceedings Paper

High-fidelity dummy fill printing with repair OPC
Author(s): Louis Lin; Wei-Long Wang; Sarah McGowan
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Paper Abstract

Dummy fill plays a crucial role on both controlling topography uniformity and ensuring device performance by manipulating homogenous pattern density. There are several types of fill to achieve this purpose on advanced technologies. The conventional way is to place them out of optical ambit range from main features as reference for Optical Proximity Correction (OPC) procedure, but it degrades the FILL performance due to leaving considerable empty space between FILL and main features. The aggressive way is to place FILL as close as main features to perfectly achieve uniform pattern density. However, in this way, it’s challenge to produce defect-free FILL in ORC (Optical Review Check) without applying model-based OPC on FILL which boost the OPC cycle time significantly. In this paper, we propose a novel approach by in-stage Repair OPC technique to not only accurately print aggressive placement FILL on the wafer accurately but also reduce the impact of run time cost on full chip OPC processing.

Paper Details

Date Published: 9 September 2013
PDF: 8 pages
Proc. SPIE 8880, Photomask Technology 2013, 88801K (9 September 2013); doi: 10.1117/12.2022009
Show Author Affiliations
Louis Lin, GLOBALFOUNDRIES Inc. (United States)
Wei-Long Wang, GLOBALFOUNDRIES Inc. (United States)
Sarah McGowan, GLOBALFOUNDRIES Inc. (United States)


Published in SPIE Proceedings Vol. 8880:
Photomask Technology 2013
Thomas B. Faure; Paul W. Ackmann, Editor(s)

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