Share Email Print
cover

Proceedings Paper

Generic process for low-cost InP integrated photonics in industrial foundries
Author(s): Luc Augustin; Huub Ambrosius; Peter Thijs; Francisco Soares; Norbert Grote; Dominik Szymanski; Mike Wale; Meint Smit
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Application Specific Photonic Integrated Circuits (ASPICs) are considered key elements to make photonic systems or subsystems cheap and ubiquitous. ASPICs still are several orders of magnitude more expensive than their microelectronic counterpart: ASICS, which has restricted their application to a few niche markets. A novel approach in photonic integration is emerging that will reduce the R&D costs of ASPICs by more than an order of magnitude. It will bring the application of ASPICs that integrate complex and advanced photonic functionality on a single chip within reach for a large number of small and larger companies and initiate a breakthrough in the application of Photonic ICs. In this paper the process is explained. A significant number of designs has been realized the last 4 years, for a variety of applications in telecoms, datacoms, medical and sensing, from parties all over the world.

Paper Details

Date Published: 22 May 2013
PDF: 7 pages
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670F (22 May 2013); doi: 10.1117/12.2020575
Show Author Affiliations
Luc Augustin, Technische Univ. Eindhoven (Netherlands)
SMART Photonics B.V. (Netherlands)
Huub Ambrosius, Technische Univ. Eindhoven (Netherlands)
Peter Thijs, Technische Univ. Eindhoven (Netherlands)
SMART Photonics B.V. (Netherlands)
Francisco Soares, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Norbert Grote, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Dominik Szymanski, Oclaro, Inc. (United Kingdom)
Mike Wale, Technische Univ. Eindhoven (Netherlands)
Oclaro, Inc. (United Kingdom)
Meint Smit, Technische Univ. Eindhoven (Netherlands)


Published in SPIE Proceedings Vol. 8767:
Integrated Photonics: Materials, Devices, and Applications II
Jean-Marc Fédéli; Laurent Vivien; Meint K. Smit, Editor(s)

© SPIE. Terms of Use
Back to Top