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Proceedings Paper

3D digital image correlation investigation of PLC effect in a new Ni–Co base superalloy
Author(s): Y. Gao; S. H. Fu; T. Cheng; X. Huo; Q. C. Zhang
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Paper Abstract

Repeated plastic instability accompanying serrated yielding in stress–strain curves and localization of deformation is observed during plastic deformation of many metallic alloys when tensile specimens are deformed under certain experimental conditions of temperature, strain rate, and pre-deformation. This phenomenon is referred to as the Portevin- Le Chatelier (PLC) effect. TMW alloy, a newly developed Ni–Co base superalloy for aircraft engine application, also exhibit PLC effect during tensile test at temperatures ranging from 300 ℃ to 600 ℃, which are also the temperature range for engine working. In this paper, a 3D digital image correlation (3D DIC) measurement system was established to observe the localization of deformation (PLC band) in a tensile test performed on TMW alloy specimen at temperature of 400 ℃. The 3D DIC system, with displacement measurement accuracy up to 0.01 pixels and strain measurement accuracy up to 100 με, has a high performance in displacement field calculation with more than 10000 points every second on a 3.1G Hz CPU computer. The test result shows that, the PLC bands are inclined at an angle of about 60° to the tensile axis. Unlike tensile test performed on aluminums alloy, the widths of PLC bands of TMW alloy specimen, ranging from 4 mm to 4.5 mm, are much greater than the specimen thickness (0.25 mm).

Paper Details

Date Published: 22 June 2013
PDF: 5 pages
Proc. SPIE 8769, International Conference on Optics in Precision Engineering and Nanotechnology (icOPEN2013), 87691O (22 June 2013); doi: 10.1117/12.2019066
Show Author Affiliations
Y. Gao, Univ. of Science and Technology of China (China)
S. H. Fu, Univ. of Science and Technology of China (China)
T. Cheng, Univ. of Science and Technology of China (China)
X. Huo, Hefei Univ. of Technology (China)
Q. C. Zhang, Univ. of Science and Technology of China (China)


Published in SPIE Proceedings Vol. 8769:
International Conference on Optics in Precision Engineering and Nanotechnology (icOPEN2013)
Chenggen Quan; Kemao Qian; Anand Asundi, Editor(s)

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