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Proceedings Paper

Micro packaging of hermetic seal laser diode module for the harsh environment of aerospace applications
Author(s): Alex A. Kazemi
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Paper Abstract

This paper describes micro soldering method of hermetic DIL (dual in line) laser diode module packaging. Normally, reliable, reproducible, high-yield packaging technologies are essential for meeting the cost, performance, and service objectives for the harsh environment of aerospace applications. For this package a new novel technique incorporating microscope with twin micro tweezers, a CCD image captured camera as monitoring probe and preformed rings of Pb-Sn and In-Sn alloys for hermetic sealing using a micro-soldering process was developed. The procedure is able to confine the solder seal to a small region inside the ferrule near the fiber feed-through hole on the wall of the DIL package. After completing the development, which included temperature and thermal cycling and analysis showed the improved method using lead-tin alloy had no fiber damage after the micro-soldering seal. The new process resulted in 100% success in our packaging design.

Paper Details

Date Published: 31 May 2013
PDF: 8 pages
Proc. SPIE 8720, Photonic Applications for Aerospace, Commercial, and Harsh Environments IV, 87200Q (31 May 2013); doi: 10.1117/12.2018153
Show Author Affiliations
Alex A. Kazemi, The Boeing Co. (United States)
ARK International (United States)

Published in SPIE Proceedings Vol. 8720:
Photonic Applications for Aerospace, Commercial, and Harsh Environments IV
Alex A. Kazemi; Bernard C. Kress; Simon Thibault, Editor(s)

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