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Proceedings Paper

Semi-insulating substrate based generic InP photonic integration platform
Author(s): Francisco M. Soares; Klemens Janiak; Jochen Kreissl; Martin Moehrle; Norbert Grote
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Paper Abstract

In the European projects EuroPIC and PARADIGM development of an InP based generic photonic integration technology is being undertaken to implement complex InP based application-specific photonic integrated circuits (ASPIC) with transmit and receive functionalities from a set of basic building blocks. The integration platform pursued at Fraunhofer HHI is building on semi-insulating substrate. Recently a variety of receiver-type PIC with up to 40 GHz bandwidth capability designed by external users was fabricated in multi-project wafer runs. Examples are demonstrated. Extension of this platform to include transmit functionalities is underway using an MOVPE based butt-coupling approach.

Paper Details

Date Published: 22 May 2013
PDF: 7 pages
Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670M (22 May 2013); doi: 10.1117/12.2017431
Show Author Affiliations
Francisco M. Soares, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Klemens Janiak, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Jochen Kreissl, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Martin Moehrle, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
Norbert Grote, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)


Published in SPIE Proceedings Vol. 8767:
Integrated Photonics: Materials, Devices, and Applications II
Jean-Marc Fédéli; Laurent Vivien; Meint K. Smit, Editor(s)

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