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Proceedings Paper

Fabrication of double-sided micro structured mechanical sensors based on SU-8 resist using a new micro molding process
Author(s): A. Oerke; S. Büttgenbach; A. Dietzel
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Paper Abstract

Advances in micro and nano fabrication technologies for MEMS require high-level measurement techniques with regard to sampling and sensitivity. For this purpose at the Institute of Microtechnology (IMT) highly sensitive piezoresistive 3D force sensors based on SU-8 polymer have been developed. In this paper we present an improved micro fabrication process for a double-sided micro structured design. The sensors are produced by multilayer processing techniques such as UV lithography and coating methods. The double-sided micro structured design demands a photoresist application method which simultaneously features a top side structuring and a casting from a mold. We use a new micro molding process to meet the demands. The micro fabrication technology is described, focusing on the development of the molding structure for shaping of the bottom side and a capable release process for the detachment of the molded structures. The fabrication process of the SU-8 mold layer is optimized to fabricate molding structures with heights from a few μm up to 350 μm. Therefore different SU-8 formulations, namely with classification numbers 5, 25, 50, and 100, have been used. The fundamental limitations for the mold design result from the lithography process, which defines the smallest lateral resolution, and from the characteristics of a molding process, e. g. the impossibility to realize an undercut. To allow for reliable release, the molding structures have to be coated with a sacrificial layer. A silicon nitride is deposited onto the substrate with an accompanying monitoring of the deposition temperature during the PECVD process.

Paper Details

Date Published: 17 May 2013
PDF: 6 pages
Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 876331 (17 May 2013); doi: 10.1117/12.2017294
Show Author Affiliations
A. Oerke, Technische Univ. Braunschweig (Germany)
S. Büttgenbach, Technische Univ. Braunschweig (Germany)
A. Dietzel, Technische Univ. Braunschweig (Germany)


Published in SPIE Proceedings Vol. 8763:
Smart Sensors, Actuators, and MEMS VI
Ulrich Schmid; José Luis Sánchez de Rojas Aldavero; Monika Leester-Schaedel, Editor(s)

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