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Proceedings Paper

Simulation, design and fabrication of a planar micro thermoelectric generator
Author(s): S. Pelegrini; A. Adami; C. Collini; P. Conci; L. Lorenzelli; A. A. Pasa
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Paper Abstract

This study describes the design, simulation, and micro fabrication of a micro thermoelectric generator (μTEG) based on planar technology using constantan (CuNi) and copper (Cu) thermocouples deposited electrochemically (ECD) on silicon substrate. The present thin film technology can be manufactured into large area and also on flexible substrate with low cost of production and can be used to exploit waste heat from equipments or hot surfaces in general. In the current implementation, the silicon structure has been designed and optimized with analytical models and FE simulations in order to exploit the different thermal conductivity of silicon and air gaps to produce the maximum temperature difference on a planar surface. The results showed that a temperature difference of 10K across the structure creates a temperature difference of 5.3K on the thermocouples, thus providing an efficiency of thermal distribution up to 55%, depending on the heat convection at the surface. Efficiency of module has been experimentally tested under different working condition, showing the dependence of module output on the external heat exchange (natural and forced convection). Maximum generated potential at 6m/s airflow is 5.7V/m2 K and thermoelectric efficiency is 1.9μW K-2 m-2.

Paper Details

Date Published: 17 May 2013
PDF: 8 pages
Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 876322 (17 May 2013); doi: 10.1117/12.2017238
Show Author Affiliations
S. Pelegrini, Fondazione Bruno Kessler (Italy)
Univ. Federal de Santa Catarina (Brazil)
A. Adami, Fondazione Bruno Kessler (Italy)
C. Collini, Fondazione Bruno Kessler (Italy)
P. Conci, Fondazione Bruno Kessler (Italy)
L. Lorenzelli, Fondazione Bruno Kessler (Italy)
A. A. Pasa, Univ. Federal de Santa Catarina (Brazil)


Published in SPIE Proceedings Vol. 8763:
Smart Sensors, Actuators, and MEMS VI
Ulrich Schmid; José Luis Sánchez de Rojas Aldavero; Monika Leester-Schaedel, Editor(s)

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