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Proceedings Paper

MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias
Author(s): B. Mukhopadhyay; M. Fritz; P. Mackowiak; T. C. Vu; O. Ehrmann; K.-D. Lang; H.-D. Ngo
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Paper Abstract

Design, simulation, fabrication, and characterization of novel MEMS pressure sensors with new back-side-direct-exposure packaging concept are presented. The sensor design is optimized for harsh environments e.g. space, military, offshore and medical applications. Unbreakable connection between the active side of the Si-sensor and the protecting glass capping was realized by anodic bonding using a thin layer of metal. To avoid signal corruption of the measured pressure caused by an encapsulation system, the media has direct contact to the backside of the Si membrane and can deflect it.

Paper Details

Date Published: 17 May 2013
PDF: 6 pages
Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 87632N (17 May 2013); doi: 10.1117/12.2017159
Show Author Affiliations
B. Mukhopadhyay, Technical Univ. of Berlin (Germany)
M. Fritz, Technical Univ. of Berlin (Germany)
P. Mackowiak, Technical Univ. of Berlin (Germany)
T. C. Vu, Technical Univ. of Berlin (Germany)
O. Ehrmann, Technical Univ. of Berlin (Germany)
K.-D. Lang, Technical Univ. of Berlin (Germany)
H.-D. Ngo, Univ. of Applied Sciences Berlin (Germany)


Published in SPIE Proceedings Vol. 8763:
Smart Sensors, Actuators, and MEMS VI
Ulrich Schmid; José Luis Sánchez de Rojas Aldavero; Monika Leester-Schaedel, Editor(s)

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