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Proceedings Paper

A large deflection model of silicon membranes for testing intrinsic stress of MEMS microphones by measuring pull-In voltage
Author(s): Florian Oesterle; Franz Fink; Harald Kuhn; Alfons Dehé; Robert Weigel; Alexander Koelpin
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Paper Abstract

Mechanical parameters, especially mechanical stress of membranes used in silicon microphones strongly depend on the manufacturing process. As a result, deviations during this process can result in sensitivity variations of the microphone. Therefore, the stress should be well controlled within a certain tensile level. This paper describes a method to test devices electrically using the MEMS related pull-in phenomenon with respect to the mechanical compliance of microphone membranes. Using this method, out of specification chips can be detected at an early stage within the manufacturing process instead of determination at a system functionality test after packaging. Therefore, the adequacy for the intended use of the pull-in voltage and its dependency on varying tensile stress due to manufacturing tolerance is evaluated.

Paper Details

Date Published: 17 May 2013
PDF: 11 pages
Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 876326 (17 May 2013); doi: 10.1117/12.2016835
Show Author Affiliations
Florian Oesterle, Univ. of Erlangen-Nuremberg (Germany)
Franz Fink, Infineon Technologies AG (Germany)
Harald Kuhn, Infineon Technologies AG (Germany)
Alfons Dehé, Infineon Technologies AG (Germany)
Robert Weigel, Univ. of Erlangen-Nuremberg (Germany)
Alexander Koelpin, Univ. of Erlangen-Nuremberg (Germany)


Published in SPIE Proceedings Vol. 8763:
Smart Sensors, Actuators, and MEMS VI
Ulrich Schmid; José Luis Sánchez de Rojas Aldavero; Monika Leester-Schaedel, Editor(s)

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