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Proceedings Paper

Flexible packaging and integration of CMOS IC with elastomeric microfluidics
Author(s): Bowei Zhang; Quan Dong; Can E. Korman; Zhenyu Li; Mona E. Zaghloul
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Paper Abstract

We have demonstrated flexible packaging and integration of CMOS IC chips with PDMS microfluidics. Microfluidic channels are used to deliver both liquid samples and liquid metals to the CMOS die. The liquid metals are used to realize electrical interconnects to the CMOS chip. As a demonstration we integrated a CMOS magnetic sensor die and matched PDMS microfluidic channels in a flexible package. The packaged system is fully functional under 3cm bending radius. The flexible integration of CMOS ICs with microfluidics enables previously unavailable flexible CMOS electronic systems with fluidic manipulation capabilities, which hold great potential for wearable health monitoring, point-of-care diagnostics and environmental sensing.

Paper Details

Date Published: 29 May 2013
PDF: 8 pages
Proc. SPIE 8730, Flexible Electronics, 873004 (29 May 2013); doi: 10.1117/12.2015554
Show Author Affiliations
Bowei Zhang, The George Washington Univ. (United States)
Quan Dong, The George Washington Univ. (United States)
Can E. Korman, The George Washington Univ. (United States)
Zhenyu Li, The George Washington Univ. (United States)
Mona E. Zaghloul, The George Washington Univ. (United States)


Published in SPIE Proceedings Vol. 8730:
Flexible Electronics
David R. Allee; Eric W. Forsythe, Editor(s)

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