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Proceedings Paper

A practical approach to LWIR wafer-level optics for thermal imaging systems
Author(s): Alan Symmons; Ray Pini
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Paper Abstract

The development and implementation of wafer level packaging for commercial microbolometers has opened the pathway towards full wafer-based thermal imaging systems. The next challenge in development is moving from discrete element LWIR imaging systems to a wafer based optical system, similar to lens assemblies found in cell phone cameras. This paper will compare a typical high volume thermal imaging design manufactured from discrete lens elements to a similar design optimized for manufacture through a wafer based approach. We will explore both performance and cost tradeoffs as well as review the manufacturability of all designs.

Paper Details

Date Published: 18 June 2013
PDF: 10 pages
Proc. SPIE 8704, Infrared Technology and Applications XXXIX, 870425 (18 June 2013); doi: 10.1117/12.2015254
Show Author Affiliations
Alan Symmons, LightPath Technologies, Inc. (United States)
Ray Pini, LightPath Technologies, Inc. (United States)

Published in SPIE Proceedings Vol. 8704:
Infrared Technology and Applications XXXIX
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton; Patrick Robert, Editor(s)

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