Share Email Print
cover

Proceedings Paper

Three-dimensional measurement and characterization of grinding tool topography
Author(s): Changcai Cui; Liam Blunt; Xiangqian Jiang; Xipeng Xu; Hui Huang; Ruifang Ye
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A comprehensive 3-dimensional measurement and characterization method for grinding tool topography was developed. A stylus instrument (SOMICRONIC, France) was used to measure the surface of a metal-bonded diamond grinding tool. The sampled data was input the software SurfStand developed by Centre for Precision Technology (CPT) for reconstruction and further characterization of the surface. Roughness parameters pertaining to the general surface and specific feature parameters relating to the grinding grits, such as height and angle peak curvature have been calculated. The methodology of measurement has been compared with that using an optical microscope. The comparison shows that the three-dimensional characterization has distinct advantages for grinding tool topography assessment. It is precise, convenient and comprehensive so it is suitable for precision measurement and analysis where an understanding of the grinding tool and its cutting ability are required.

Paper Details

Date Published: 31 January 2013
PDF: 8 pages
Proc. SPIE 8759, Eighth International Symposium on Precision Engineering Measurement and Instrumentation, 87590Q (31 January 2013); doi: 10.1117/12.2015004
Show Author Affiliations
Changcai Cui, Univ. of Huddersfield (United Kingdom)
Huaqiao Univ. (China)
Liam Blunt, Univ. of Huddersfield (United Kingdom)
Xiangqian Jiang, Univ. of Huddersfield (United Kingdom)
Xipeng Xu, MOE Engineering Research Ctr. for Brittle Materials Machining (China)
Hui Huang, Huaqiao Univ. (China)
Ruifang Ye, Huaqiao Univ. (China)


Published in SPIE Proceedings Vol. 8759:
Eighth International Symposium on Precision Engineering Measurement and Instrumentation
Jie Lin, Editor(s)

© SPIE. Terms of Use
Back to Top