Share Email Print
cover

Proceedings Paper

Etch correction and OPC: a look at the current state and future of etch correction
Author(s): Ian Stobert; Derren Dunn
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Various forms of Optical Proximity Correction (OPC) have been employed for over twenty years to address local lithographic printing effects. As lithography modeling capabilities have improved, so too have the sophistication and complexity of OPC solutions. In the same time frame, there have been advances in etch modeling capabilities, but the complexity of the correction schemes used to address etch effects have lagged a few years behind lithographic OPC correction. In this paper we examine some of the challenges faced in etch modeling and correction. We describe some of the etch correction tools and techniques used in current mask tape out flows. Finally, we use the last few years of advances in OPC correction to predict what form etch correction will take going forward, both in EUV flows, and in traditional non-EUV OPC flows in the 10nm node and beyond.

Paper Details

Date Published: 29 March 2013
PDF: 11 pages
Proc. SPIE 8685, Advanced Etch Technology for Nanopatterning II, 868504 (29 March 2013); doi: 10.1117/12.2015000
Show Author Affiliations
Ian Stobert, IBM Corp. (United States)
Derren Dunn, IBM Corp. (United States)


Published in SPIE Proceedings Vol. 8685:
Advanced Etch Technology for Nanopatterning II
Ying Zhang; Gottlieb S. Oehrlein; Qinghuang Lin, Editor(s)

© SPIE. Terms of Use
Back to Top