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Proceedings Paper

High-performance LWIR microbolometer with Si/SiGe quantum well thermistor and wafer level packaging
Author(s): Audun Roer; Adriana Lapadatu; Erik Wolla; Gjermund Kittilsland
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Paper Abstract

An uncooled microbolometer with peak responsivity in the long wave infrared region of the electromagnetic radiation is developed at Sensonor AS. It is a 384 x 288 focal plane array with a pixel pitch of 25µm, based on monocrystalline Si/SiGe quantum wells as IR sensitive material. The high sensitivity (TCR) and low 1/f-noise are the main performance characteristics of the product. The frame rate is maximum 60Hz and the output interface is digital (LVDS). The quantum well thermistor material is transferred to the read-out integrated circuit (ROIC) by direct wafer bonding. The ROIC wafer containing the released pixels is bonded in vacuum with a silicon cap wafer, providing hermetic encapsulation at low cost. The resulting wafer stack is mounted in a standard ceramic package. In this paper the architecture of the pixels and the ROIC, the wafer packaging and the electro-optical measurement results are presented.

Paper Details

Date Published: 11 June 2013
PDF: 9 pages
Proc. SPIE 8704, Infrared Technology and Applications XXXIX, 87041B (11 June 2013); doi: 10.1117/12.2014914
Show Author Affiliations
Audun Roer, Sensonor AS (Norway)
Adriana Lapadatu, Sensonor AS (Norway)
Erik Wolla, Sensonor AS (Norway)
Gjermund Kittilsland, Sensonor AS (Norway)

Published in SPIE Proceedings Vol. 8704:
Infrared Technology and Applications XXXIX
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton; Patrick Robert, Editor(s)

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