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Proceedings Paper

Active or passive fiber-chip-alignment: approaches to efficient solutions
Author(s): Gunnar Böttger; Henning Schröder; Rafael Jordan
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Paper Abstract

High precision approaches for active and passive alignment and assembly on optoelectronic micro benches have been realized at Fraunhofer IZM for various material systems and different scales. The alignment and reliable mounting of optical subcomponents such as semiconductor laser and photo diodes, micro lenses and micro prisms require far higher mounting and alignment accuracies than for micro-electronic parts. When connecting from silicon photonics chip level to single mode optical fibers, even higher precisions are called for (typically < 100 nm). Alignment and assembly commonly are performed on specialized lab equipment which needs manual operation, consuming a lot of time, with less possibilities for automation. To introduce a higher degree of automatized production, like it has become standard in large volume electronics, one can choose either active or passive alignment processes - or possibly a combination of both. In this article we will present examples of micro-optic benches and optical interconnections that include alignment structures for passive alignment - where the accuracy lies in the components to be assembled, and mounting takes place on a less accurate machine (“fit into place”). But there is also a lot of progress on optical "pick, measure and place" machines that realize a flexible and fully automated active alignment using vision systems and activated components of less cost, with machine and process robustness for usability in industrial environments. As connecting elements, passive optical components like optical fibers are commonly used. These fragile and flexible elements pose additional challenges in secure picking, placing and fixing, at long lengths vs. small diameters. A very recent and specific approach to use more robust plastic optical fibers (POF) for very short and cost effective optical interconnects by means of wire bonding machines will be presented.

Paper Details

Date Published: 27 February 2013
PDF: 17 pages
Proc. SPIE 8630, Optoelectronic Interconnects XIII, 863006 (27 February 2013); doi: 10.1117/12.2014176
Show Author Affiliations
Gunnar Böttger, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Henning Schröder, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Rafael Jordan, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)


Published in SPIE Proceedings Vol. 8630:
Optoelectronic Interconnects XIII
Alexei L. Glebov; Ray T. Chen, Editor(s)

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