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Proceedings Paper

Uncooled infrared detector with 12um pixel pitch video graphics array
Author(s): Tsutomu Endoh; Shigeru Tohyama; Takao Yamazaki; Yutaka Tanaka; Kuniyuki Okuyama; Seiji Kurashina; Masaru Miyoshi; Kouji Katoh; Takashi Yamamoto; Yuuhi Okuda; Tokuhito Sasaki; Haruo Ishizaki; Tomohiko Nakajima; Kentaro Shinoda; Tetsuo Tsuchiya
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Paper Abstract

Uncooled infrared detectors with 12μm pixel pitch video graphics array (VGA) have been developed. To improve the signal to noise ratio (SNR) for 12μm pixel pitch, a highly sensitive bolometer material, an advanced pixel structure for thermal isolation and a newly designed read-out IC (ROIC) have been also developed. The bolometer material has been improved by using vanadium niobate. Over a wide range of temperature, temperature coefficient of resistance (TCR) is achieved higher level than -3.6%/K, which is 2 times higher than that for the conventional bolometer material. For thermal isolation, thermal conductance (Gth) value for the new pixel structure, fabricated by using triple level sacrificial layer process, is estimated to be 5nW/K, which is 1/5 times lower than that for the conventional pixel structure. On the other hand, since the imaging area is reduced by the pixel pitch, the uniformity of pixel can be improved. This enables to remove the non-uniformity correction (NUC) circuit in the ROIC. Removal of this circuit is effective for low power and low noise. This 12μm pixel pitch VGA detector is packaged in a compact (24 × 24 × 6.5 mm) and lightweight (11g) ceramic package. In addition, it has been incorporated in a newly developed prototype miniature imager. The miniature imager has dimension of 25(H) ×25(W) ×28(L) mm and weight of 30g. This imager is compact and small enough to fit in your hand. Hereafter, this imager is greatly expected to be applied to mobile systems.

Paper Details

Date Published: 11 June 2013
PDF: 11 pages
Proc. SPIE 8704, Infrared Technology and Applications XXXIX, 87041G (11 June 2013); doi: 10.1117/12.2013690
Show Author Affiliations
Tsutomu Endoh, NEC Corp. (Japan)
Shigeru Tohyama, NEC Corp. (Japan)
Takao Yamazaki, NEC Corp. (Japan)
Yutaka Tanaka, NEC Corp. (Japan)
Kuniyuki Okuyama, NEC Corp. (Japan)
Seiji Kurashina, NEC Corp. (Japan)
Masaru Miyoshi, NEC Corp. (Japan)
Kouji Katoh, NEC Corp. (Japan)
Takashi Yamamoto, NEC Corp. (Japan)
Yuuhi Okuda, NEC Corp. (Japan)
Tokuhito Sasaki, NEC Corp. (Japan)
Haruo Ishizaki, National Institute of Advanced Industrial Science and Technology (Japan)
Tomohiko Nakajima, National Institute of Advanced Industrial Science and Technology (Japan)
Kentaro Shinoda, National Institute of Advanced Industrial Science and Technology (Japan)
Tetsuo Tsuchiya, National Institute of Advanced Industrial Science and Technology (Japan)


Published in SPIE Proceedings Vol. 8704:
Infrared Technology and Applications XXXIX
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton; Patrick Robert, Editor(s)

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