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Proceedings Paper

Modified polyhydroxystyrenes as matrix resins for dissolution inhibition type photoresists
Author(s): Georg Pawlowski; Thomas P. Sauer; Ralph R. Dammel; Douglas J. Gordon; William D. Hinsberg; Dennis R. McKean; Charlet R. Lindley; Hans-Joachim Merrem; Heinz Roeschert; Richard Vicari; C. Grant Willson
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Paper Abstract

It is generally accepted that the production of shrink versions of the 16 MB DRAM and the 64 MB DRAM generations will be patterned using deep UV radiation. This provides a new challenge to the photoresist suppliers, as the standard photoresist formulations are not suitable for this technology, mainly because the presently used novolak resins are highly opaque in the 200 - 300 nm region. This is especially true for the 248 nm wavelength of KrF eximer lasers. Poly 4- hydroxystyrene [PHS] has several advantages in transmission and thermal stability; however, its dissolution rate in commercial grade developers is unacceptably high. We report some recent results on modified, alkyl-substituted PHS derivatives. These polymers combine reduced alkaline solubiity with adequate optical and thermal properties, making them acceptable for future deep UV based production processes. Selected data of these new (co)polymers are discussed.

Paper Details

Date Published: 1 June 1990
PDF: 10 pages
Proc. SPIE 1262, Advances in Resist Technology and Processing VII, (1 June 1990); doi: 10.1117/12.20135
Show Author Affiliations
Georg Pawlowski, Hoechst AG (United States)
Thomas P. Sauer, IBM/Almaden Research Ctr. (United States)
Ralph R. Dammel, Hoechst AG (United States)
Douglas J. Gordon, Hoechst Celanese Corp. (United States)
William D. Hinsberg, IBM/Almaden Research Ctr. (United States)
Dennis R. McKean, IBM/Almaden Research Ctr. (United States)
Charlet R. Lindley, Hoechst AG (Germany)
Hans-Joachim Merrem, Hoechst AG (United States)
Heinz Roeschert, Hoechst AG (Germany)
Richard Vicari, Hoechst Celanese Corp. (United States)
C. Grant Willson, IBM/Almaden Research Ctr. (United States)

Published in SPIE Proceedings Vol. 1262:
Advances in Resist Technology and Processing VII
Michael P. C. Watts, Editor(s)

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