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Proceedings Paper

Highly sensitive x-ray and electron-beam resists using chemical amplification
Author(s): Ralph R. Dammel; Charlet R. Lindley; Georg Pawlowski; Ude Scheunemann; Juergen Theis
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Paper Abstract

Highly sensitive resist materials are one of the prerequisites for the economic viability of X- ray and E -beam lithography. The principle of chemical anzphfication coupled with the three - component system (3CS) concept leads the way to the design of highly sensitive, yet as the same time process stable materials which fulfill the requirements of modem semiconductor patterning methods. Two experimental 3CS resist systems using chemical amplification, the positive -tone resist RAY- PF and and the negative - tone resist RAZ PNJJ4, will be presented, and their suitability for X- ray and E - beam application exa,nined.

Paper Details

Date Published: 1 June 1990
PDF: 13 pages
Proc. SPIE 1262, Advances in Resist Technology and Processing VII, (1 June 1990); doi: 10.1117/12.20134
Show Author Affiliations
Ralph R. Dammel, Hoechst AG (United States)
Charlet R. Lindley, Hoechst AG (Germany)
Georg Pawlowski, Hoechst AG (United States)
Ude Scheunemann, Hoechst AG (Germany)
Juergen Theis, Hoechst AG (Germany)

Published in SPIE Proceedings Vol. 1262:
Advances in Resist Technology and Processing VII
Michael P. C. Watts, Editor(s)

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