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Proceedings Paper

Developments in packaging and integration for silicon photonics
Author(s): Bradley W. Snyder; Peter A. O'Brien
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Paper Abstract

Recent progress in the packaging and integration of silicon photonics devices and systems is presented. An overview of various fiber packaging techniques is given, including a detailed description of a planar fiber packaging process for single fibers and arrays of fibers based on grating couplers. An overview of techniques for integrating lasers with silicon photonics circuits is also given, including details on a hybrid integration technology based on a ceramic micro-optical bench suitable for use with tunable and high-speed directly-modulated lasers. Both of the technologies discussed in detail are suitable for passive alignment and wafer-scale assembly.

Paper Details

Date Published: 9 March 2013
PDF: 9 pages
Proc. SPIE 8614, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII, 86140D (9 March 2013); doi: 10.1117/12.2012735
Show Author Affiliations
Bradley W. Snyder, Tyndall National Institute (Ireland)
Peter A. O'Brien, Tyndall National Institute (Ireland)


Published in SPIE Proceedings Vol. 8614:
Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII
Rajeshuni Ramesham; Herbert R. Shea, Editor(s)

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