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Proceedings Paper

Rectification of EUV-patterned contact holes using directed self-assembly
Author(s): Roel Gronheid; Arjun Singh; Todd R. Younkin; Paulina Rincon Delgadillo; Paul Nealey; Boon Teik Chan; Kathleen Nafus; Ainhoa Romo Negreira; Mark Somervell
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Paper Abstract

One critical problem with EUV patterning is the local CD variation of contact holes. The issue is especially problematic for patterning of sub-30nm hole dimensions. Although the EUV wavelength enables resolution of fine contact patterns, shot noise effects (both chemical and optical) result in high levels of CD non-uniformity. Directed self-assembly (DSA) offers the possibility of rectifying this non-uniformity. Since the resulting CD in this patterning approach is typically dictated by the polymer size, application of this technology in conjunction with an EUV-defined pre-pattern can theoretically improve the local CD uniformity. Integration approaches using both chemo- and grapho-epitaxy integration may be used to achieve DSA enabled uniformity improvement. The drawbacks and benefits of both approaches will be discussed. Finally, these types of DSA flows also enable frequency multiplication to achieve dense arrays from an initially sparse pattern. In this study, we will report on a variety of schemes to attain rectification and frequency multiplication.

Paper Details

Date Published: 29 March 2013
PDF: 10 pages
Proc. SPIE 8682, Advances in Resist Materials and Processing Technology XXX, 86820A (29 March 2013); doi: 10.1117/12.2012667
Show Author Affiliations
Roel Gronheid, IMEC (Belgium)
Arjun Singh, IMEC (Belgium)
Katholieke Univ. Leuven (Belgium)
Todd R. Younkin, Intel Corp. (United States)
Paulina Rincon Delgadillo, IMEC (Belgium)
Katholieke Univ. Leuven (Belgium)
The Univ. of Chicago (United States)
Paul Nealey, The Univ. of Chicago (United States)
Boon Teik Chan, IMEC (Belgium)
Kathleen Nafus, Tokyo Electron America, Inc. (United States)
Ainhoa Romo Negreira, Tokyo Electron America, Inc. (United States)
Mark Somervell, Tokyo Electron America, Inc. (United States)


Published in SPIE Proceedings Vol. 8682:
Advances in Resist Materials and Processing Technology XXX
Mark H. Somervell, Editor(s)

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