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Proceedings Paper

Investigation of trench and contact hole shrink mechanism in the negative tone develop process
Author(s): Sohan Singh Mehta; Craig Higgins; Vikrant Chauhan; Shyam Pal; Hui Peng Koh; Jean Raymond Fakhoury; Shaowen Gao; Lokesh Subramany; Salman Iqbal; Bumhwan Jeon; Pedro Morrison; Chris Karanikas; Yayi Wei; David R. Cho
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Paper Abstract

The objective of this work was to study the trench and contact hole shrink mechanism in negative tone develop resist processes and its manufacturability challenges associated for 20nm technology nodes and beyond. Process delay from post-exposure to develop, or “queue time”, is studied in detail. The impact of time link delay on resolved critical dimension (CD) is fully characterized for patterned resist and etched geometries as a function of various process changes. In this study, we assembled a detailed, theoretical model and performed experimental work to correlated time link delay to acid diffusion within the resist polymer matrix. Acid diffusion is determined using both a modulation transfer function for diffusion and simple approximation based on Fick’s law of diffusion.

Paper Details

Date Published: 29 March 2013
PDF: 9 pages
Proc. SPIE 8682, Advances in Resist Materials and Processing Technology XXX, 86820O (29 March 2013); doi: 10.1117/12.2012331
Show Author Affiliations
Sohan Singh Mehta, GLOBALFOUNDRIES Inc. (United States)
Craig Higgins, GLOBALFOUNDRIES Inc. (United States)
Vikrant Chauhan, GLOBALFOUNDRIES Inc. (United States)
Shyam Pal, GLOBALFOUNDRIES Inc. (United States)
Hui Peng Koh, GLOBALFOUNDRIES Inc. (United States)
Jean Raymond Fakhoury, GLOBALFOUNDRIES Inc. (United States)
Shaowen Gao, GLOBALFOUNDRIES Inc. (United States)
Lokesh Subramany, GLOBALFOUNDRIES, Inc. (United States)
Salman Iqbal, GLOBALFOUNDRIES Inc. (United States)
Bumhwan Jeon, GLOBALFOUNDRIES Inc. (United States)
Pedro Morrison, GLOBALFOUNDRIES Inc. (United States)
Chris Karanikas, GLOBALFOUNDRIES Inc. (United States)
Yayi Wei, GLOBALFOUNDRIES Inc. (United States)
David R. Cho, GLOBALFOUNDRIES Inc. (United States)

Published in SPIE Proceedings Vol. 8682:
Advances in Resist Materials and Processing Technology XXX
Mark H. Somervell, Editor(s)

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