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Proceedings Paper

Novel cresol/chloroacetaldehyde novolacs for high-temperature resist applications
Author(s): Thomas R. Sarubbi; Andrew J. Blakeney; Joseph J. Sizensky; Nancy N. Greene; Shinji Sakaguchi; Shiro Tan; Gregory Luckman
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Paper Abstract

A new class of novolacs has been developed which imparts a unique blend of sensitivity, submicron resolution and image thennai flow resistance to positive photoresist formulations. The novolac system is based upon condensation of metaand para-cresol with a chloroaceta!dehyde equivalent. The resists are based upon formulations of the new chloroacetaidehyde (CM) novolacs and typical diazonaphthoquinone photoactive compounds. The resist image thermal flow temperatures can exceed 200°C depending upon the molecular weight and composition of the novolac. As a result of the high thermal flow properties of the CM novolac, the resists are verb' stable to reticulation in aluminum or oxide plasma etching environments, eliminating the need for Deep UV curing.

Paper Details

Date Published: 1 June 1990
PDF: 11 pages
Proc. SPIE 1262, Advances in Resist Technology and Processing VII, (1 June 1990); doi: 10.1117/12.20121
Show Author Affiliations
Thomas R. Sarubbi, Olin Hunt Specialty Products I (United States)
Andrew J. Blakeney, Olin Hunt Specialty Products I (United States)
Joseph J. Sizensky, Olin Hunt Specialty Products Inc. (United States)
Nancy N. Greene, Olin Hunt Specialty Products Inc. (United States)
Shinji Sakaguchi, Fuji Photo Film Co., Ltd. (Japan)
Shiro Tan, Fuji Photo Film Co., Ltd. (Japan)
Gregory Luckman, Olin Corp. (United States)


Published in SPIE Proceedings Vol. 1262:
Advances in Resist Technology and Processing VII
Michael P. C. Watts, Editor(s)

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