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Proceedings Paper

Low thermal expansion material (LTEM) cleaning and optimization for extreme ultraviolet (EUV) blank deposition
Author(s): Arun John Kadaksham; Ranganath Teki; Milton Godwin; Matt House; Frank Goodwin
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Paper Abstract

With the insertion of extreme ultraviolet lithography (EUVL) for high volume manufacturing (HVM) expected in the next few years, it is necessary to examine the performance of low thermal expansion materials (LTEMs) and assess industry readiness of EUV substrates. Owing to the high cost of LTEM, most of the development work so far has been done on fused silica substrates. Especially in developing cleaning technology prior to multilayer deposition, fused silica substrates have been used extensively, and defect trends and champion blank data have been reported using multilayer deposition data on fused silica substrates. In this paper, the response of LTEMs to cleaning processes prior to multilayer deposition is discussed. Cleaning processes discussed in this paper are developed using fused silica substrates and applied on LTEM substrates. The defectivity and properties of LTEM to fused silica are compared. Using the dense scan feature of the substrate inspection tool capable of detecting defects down to 35 nm SiO2 equivalent size and appropriate defect decoration techniques to decorate small defects on substrates to make them detectable, cleaning technologies that have the potential to meet high demands on LTEM for EUVL are developed and optimized.

Paper Details

Date Published: 1 April 2013
PDF: 7 pages
Proc. SPIE 8679, Extreme Ultraviolet (EUV) Lithography IV, 86791R (1 April 2013); doi: 10.1117/12.2011718
Show Author Affiliations
Arun John Kadaksham, SEMATECH Inc. (United States)
Ranganath Teki, SEMATECH Inc. (United States)
Milton Godwin, SEMATECH Inc. (United States)
Matt House, SEMATECH Inc. (United States)
Frank Goodwin, SEMATECH Inc. (United States)


Published in SPIE Proceedings Vol. 8679:
Extreme Ultraviolet (EUV) Lithography IV
Patrick P. Naulleau, Editor(s)

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