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Proceedings Paper

Evaluating scatterometry 3D capabilities for EUV
Author(s): Jie Li; Oleg Kritsun; Prasad Dasari; Catherine Volkman; Tom Wallow; Jiangtao Hu
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Paper Abstract

Optical critical dimension (OCD) metrology using scatterometry has been demonstrated to be a viable solution for fast and non-destructive in-line process control and monitoring. As extreme ultraviolet lithography (EUVL) is more widely adopted to fabricate smaller and smaller patterns for electronic devices, scatterometry faces new challenges due to several reasons. For 14nm node and beyond, the feature size is nearly an order of magnitude smaller than the shortest wavelength used in scatterometry. In addition, thinner resist layer is used in EUVL compared with conventional lithography, which leads to reduced measurement sensitivity. Despite these difficulties, tolerance has reduced for smaller feature size. In this work we evaluate 3D capability of scatterometry for EUV process using spectroscopic ellipsometry (SE). Three types of structures, contact holes, tip-to-tip, and tip-to-edge, are studied to test CD and end-gap metrology capabilities. The wafer is processed with focus and exposure matrix. Good correlations to CD-SEM results are achieved and good dynamic precision is obtained for all the key parameters. In addition, the fit to process provides an independent method to evaluate data quality from different metrology tools such as OCD and CDSEM. We demonstrate 3D capabilities of scatterometry OCD metrology for EUVL using spectroscopic ellipsometry, which provides valuable in-line metrology for CD and end-gap control in electronic circuit fabrications.

Paper Details

Date Published: 10 April 2013
PDF: 11 pages
Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 86810S (10 April 2013); doi: 10.1117/12.2011675
Show Author Affiliations
Jie Li, Nanometrics Inc. (United States)
Oleg Kritsun, GLOBALFOUNDRIES (United States)
Prasad Dasari, Nanometrics Inc. (United States)
Catherine Volkman, GLOBALFOUNDRIES (United States)
Tom Wallow, GLOBALFOUNDRIES (United States)
Jiangtao Hu, Nanometrics Inc. (United States)


Published in SPIE Proceedings Vol. 8681:
Metrology, Inspection, and Process Control for Microlithography XXVII
Alexander Starikov; Jason P. Cain, Editor(s)

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