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Proceedings Paper

Quantifying throughput improvements for electron-beam lithography using a suite of benchmark patterns
Author(s): John G. Hartley; Nigel Crosland; Robert C. Dowling; Philip C. Hoyle; Andrew McClelland; Martin Turnidge; James H. Smith
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Paper Abstract

The Vistec VB300 Gaussian electron-beam lithography system at the College of Nanoscale Science and Engineering (CNSE) in Albany routinely exposes 300 mm wafers to meet the requirements of nano-patterning for metrology and process tool qualification. CNSE and Vistec are partners in a continuous throughput improvement program. The first stage of this program has recently been implemented on CNSE’s VB300. To quantify the improvements, we have defined a suite of benchmark patterns to compare throughput “before and after”, which we plan to use throughout the entire program. These benchmark patterns show throughput improvements of up to a factor of 2.5 on the VB300. We believe this method of measuring throughput could be applied to other lithography systems that exhibit a throughput dependency on pattern type.

Paper Details

Date Published: 26 March 2013
PDF: 13 pages
Proc. SPIE 8680, Alternative Lithographic Technologies V, 86800P (26 March 2013); doi: 10.1117/12.2011664
Show Author Affiliations
John G. Hartley, State Univ. of New York at Albany (United States)
Nigel Crosland, Vistec Lithography Inc. (United States)
Robert C. Dowling, Vistec Lithography Inc. (United States)
Philip C. Hoyle, Independent Consultant to Vistec Lithography Inc. (United Kingdom)
Andrew McClelland, Cambeam Systems Design Services Ltd. (United Kingdom)
Martin Turnidge, Vistec Lithography Inc. (United States)
James H. Smith, Vistec Lithography Inc. (United States)

Published in SPIE Proceedings Vol. 8680:
Alternative Lithographic Technologies V
William M. Tong, Editor(s)

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