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Proceedings Paper

Lithography focus/exposure control and corrections to improve CDU
Author(s): Young Ki Kim; Mark Yelverton; Joungchel Lee; Jerry Cheng; Hong Wei; Jeong Soo Kim; Karsten Gutjahr; Jie Gao; Ram Karur-Shanmugam; Pedro Herrera; Kevin Huang; Roie Volkovich; Bill Pierson
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Paper Abstract

As leading edge lithography moves to advanced nodes which requires better critical dimension (CD) control ability within wafer. Current methods generally make exposure corrections by field via factory automation or by sub-recipe to improve CD uniformity. KLA-Tencor has developed a method to provide CD uniformity (CDU) control using a generated Focus/Exposure (F/E) model from a representative process. Exposure corrections by each field can be applied back to the scanner so as to improve CD uniformity through the factory automation. CDU improvement can be observed either at after lithography or after etch metrology steps. In addition to corrections, the graphic K-T Analyzer interface also facilitates the focus/exposure monitoring at the extreme wafer edge. This paper will explain the KT CDFE method and the application in production environment. Run to run focus/exposure monitoring will be carried out both on monitoring and production wafers to control the wafer process and/or scanner fleet. CDU improvement opportunities will be considered as well.

Paper Details

Date Published: 10 April 2013
PDF: 8 pages
Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 86811P (10 April 2013); doi: 10.1117/12.2011534
Show Author Affiliations
Young Ki Kim, GLOBALFOUNDRIES (United States)
Mark Yelverton, GLOBALFOUNDRIES (United States)
Joungchel Lee, GLOBALFOUNDRIES (United States)
Jerry Cheng, GLOBALFOUNDRIES (United States)
Hong Wei, GLOBALFOUNDRIES (United States)
Jeong Soo Kim, GLOBALFOUNDRIES (United States)
Karsten Gutjahr, GLOBALFOUNDRIES (United States)
Jie Gao, KLA-Tencor Corp. (United States)
Ram Karur-Shanmugam, KLA-Tencor Corp. (United States)
Pedro Herrera, KLA-Tencor Corp. (United States)
Kevin Huang, KLA-Tencor Corp. (United States)
Roie Volkovich, KLA-Tencor Corp. (United States)
Bill Pierson, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 8681:
Metrology, Inspection, and Process Control for Microlithography XXVII
Alexander Starikov; Jason P. Cain, Editor(s)

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