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Proceedings Paper

Feasibility study of resist slimming for SIT
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Paper Abstract

Wet chemical slimming of resist can enable a resist mandrel for sidewall-image transfer (SIT) by decreasing the mandrel width and smoothing the mandrel sidewalls. This would reduce the cost of the SIT process. Several key metrics are used to compare the traditional etched mandrel and the slimmed resist mandrel, including: process window, critical dimension uniformity, and defectivity. New resists are shown to have larger process windows after slimming than an etched mandrel process while maintaining comparable critical dimension uniformity. The major challenge to the resist mandrel is the profile post-slim.

Paper Details

Date Published: 29 March 2013
PDF: 7 pages
Proc. SPIE 8682, Advances in Resist Materials and Processing Technology XXX, 86820E (29 March 2013); doi: 10.1117/12.2011506
Show Author Affiliations
Nicole Saulnier, IBM Corp. (United States)
Chiew-seng Koay, IBM Corp. (United States)
Matthew Colburn, IBM Corp. (United States)
David Hetzer, Tokyo Electron Technology Ctr., America, LLC (United States)
Michael Cicoria, Tokyo Electron Technology Ctr., America, LLC. (United States)
Jonathan Ludwicki, Tokyo Electron Technology Ctr., America, LLC (United States)


Published in SPIE Proceedings Vol. 8682:
Advances in Resist Materials and Processing Technology XXX
Mark H. Somervell, Editor(s)

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