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Proceedings Paper

Sidewall profile control through processing and dye additives
Author(s): Eitan Shalom; Donald W. Johnson; Kelly Hale; Terry Pebbles; William B. Curtis
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Paper Abstract

This paper studies e effects of process conditions and dye additives on sidewall profiles using RS—1 designed experiments. We have explored the mechanism of forming negative sidewall profiles (above 90) in a positive photoresist, the dependence of depth of focus (DOF) and exposure latitude upon sidewall angle The resist studied is a positive, dual purpose (g—, i—line) resist, ULTRAMAC EL2015. The study presented in this paper was done in i—line but similar phenomena were observed in g—line as well. The effect of two different actirtic dyes in various concentrations on wall angle control is demonstrated. The two dyes investigated are both soluble in resist solvent but their solubility in developer is very different and their effect on required exposure energy is different. The contribution of the dyes to the absorption of the resist, their effect on swing curve and surface inhibition is evaluated and compared. The surface inhibition effect of undyed resist has been determined to be the most critical parameter influencing profiles, as increased post exposure bake temperature increases sidewall profile angle.

Paper Details

Date Published: 1 June 1990
PDF: 18 pages
Proc. SPIE 1262, Advances in Resist Technology and Processing VII, (1 June 1990); doi: 10.1117/12.20115
Show Author Affiliations
Eitan Shalom, MacDermid Inc. (Israel)
Donald W. Johnson, MacDermid Inc. (United States)
Kelly Hale, MacDermid Inc. (United States)
Terry Pebbles, MacDermid Inc. (United States)
William B. Curtis, MacDermid Inc. (United States)

Published in SPIE Proceedings Vol. 1262:
Advances in Resist Technology and Processing VII
Michael P. C. Watts, Editor(s)

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