Share Email Print

Proceedings Paper

Study of LWR reduction and pattern collapse suppression for 16nm node EUV resists
Author(s): Eishi Shiobara; Yukiko Kikuchi; Toshiro Itani
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

EUV lithography is the most promising future technology for manufacturing devices at and below 16-nm half-pitch node. However, line width roughness (LWR) and pattern collapse are major concerns in device manufacture. In this study, the ability of surfactant rinses to reduce LWR and suppress pattern collapse was investigated. Certain surfactant rinses achieved both. We analyzed the critical dimension (CD) variation of resist patterns during surfactant rinse by highspeed atomic force microscopy (HS-AFM). No significant swelling was observed during the rinse process. We also evaluated a smoothing process subsequent to rinsing; namely, the highly controllable post-bake process. Surfactant rinse followed by post-bake process further reduced LWR.

Paper Details

Date Published: 1 April 2013
PDF: 7 pages
Proc. SPIE 8679, Extreme Ultraviolet (EUV) Lithography IV, 86792B (1 April 2013); doi: 10.1117/12.2011482
Show Author Affiliations
Eishi Shiobara, EUVL Infrastructure Development Ctr., Inc. (Japan)
Yukiko Kikuchi, EUVL Infrastructure Development Ctr., Inc. (Japan)
Toshiro Itani, EUVL Infrastructure Development Ctr., Inc. (Japan)

Published in SPIE Proceedings Vol. 8679:
Extreme Ultraviolet (EUV) Lithography IV
Patrick P. Naulleau, Editor(s)

© SPIE. Terms of Use
Back to Top