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Proceedings Paper

Wafer sub-layer impact in OPC/ORC models for 2x nm node implant layers
Author(s): Jean-Christophe Le-Denmat; Catherine Martinelli; Elodie Sungauer; Jean-Christophe Michel; Emek Yesilada; Frederic Robert
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Paper Abstract

From 28nm technology node and below, Optical Proximity Correction (OPC) needs to take into account light scattering effects from prior layers when bottom anti-reflective coating (BARC) is not used, which is typical for implant layers. In this paper, we implement a sub-layer aware simulation method into a verification tool for Optical Rule Check (ORC) that is used on full 28nm test chip. The sub-layer aware verification can predict defects that are missed by standard ORC. SEM-CD review and defectivity analysis were used to confirm the validity of the sub-layer aware model on wafer.

Paper Details

Date Published: 12 April 2013
PDF: 7 pages
Proc. SPIE 8683, Optical Microlithography XXVI, 868314 (12 April 2013); doi: 10.1117/12.2011424
Show Author Affiliations
Jean-Christophe Le-Denmat, STMicroelectronics (France)
Catherine Martinelli, STMicroelectronics (France)
Elodie Sungauer, STMicroelectronics (France)
Jean-Christophe Michel, STMicroelectronics (France)
Emek Yesilada, STMicroelectronics (France)
Frederic Robert, STMicroelectronics (France)


Published in SPIE Proceedings Vol. 8683:
Optical Microlithography XXVI
Will Conley, Editor(s)

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