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Proceedings Paper

Negative tone imaging process and materials for EUV lighography
Author(s): Shinji Tarutani; Wataru Nihashi; Shuuji Hirano; Natsumi Yokokawa; Hiroo Takizawa
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Paper Abstract

The advantages of NTI process in EUV is demonstrated by optical simulation method for 0.25NA and 0.33NA illumination system with view point of optical aerial image quality and photon density. The extendability of NTI for higher NA system is considered for further tight pitch and small size contact hole imaging capability. Process and material design strategy to NTI were discussed with consideration on comparison to ArF NTI process and materials, and challenges in EUV materials dedicated to NTI process were discussed as well. A new polymer was well designed for EUV-NTD process, and the resists formulated with the new polymer demonstrated good advantage of resolution and sensitivity in isolated trench imaging, and 24 nm half pitch resolution at dense C/H, with 0.3NA MET tool.

Paper Details

Date Published: 29 March 2013
PDF: 6 pages
Proc. SPIE 8682, Advances in Resist Materials and Processing Technology XXX, 868214 (29 March 2013); doi: 10.1117/12.2011384
Show Author Affiliations
Shinji Tarutani, FUJIFILM Corp. (Japan)
Wataru Nihashi, FUJIFILM Corp. (Japan)
Shuuji Hirano, FUJIFILM Corp. (Japan)
Natsumi Yokokawa, FUJIFILM Corp. (Japan)
Hiroo Takizawa, FUJIFILM Corp. (Japan)

Published in SPIE Proceedings Vol. 8682:
Advances in Resist Materials and Processing Technology XXX
Mark H. Somervell, Editor(s)

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