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Proceedings Paper

A study of vertical lithography for high-density 3D structures
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Paper Abstract

In recent years, demand for high-density integration of semiconductor chips has steadily increased due to miniaturization and high-performance requirements of electronics including Smartphones and Tablet PCs. In addition to 3D integration using Through-Silicon Via (TSV) technology, 2.5D integration technology using silicon interposers has also become a hot topic. Canon has identified key challenges that must be solved for successful implementation of high-density integration technologies into mass production and to meet these challenges, Canon developed the FPA-5510iV i-line lithography tool (stepper) that is now in wide use at customer sites for their most challenging processes. In this paper, Canon will explain details of FPA-5510iV features that support high-density integration. Canon will also introduce additional challenges that must be solved to ensure the success of high-density integration technologies in mass production, as well as Canon efforts to solve the remaining challenges.

Paper Details

Date Published: 12 April 2013
PDF: 9 pages
Proc. SPIE 8683, Optical Microlithography XXVI, 86831F (12 April 2013); doi: 10.1117/12.2011340
Show Author Affiliations
Masaki Mizutani, Canon Inc. (Japan)
Shin-Ichiro Hirai, Canon Inc. (Japan)
Ichiro Koizumi, Canon Inc. (Japan)
Ken-Ichiro Mori, Canon Inc. (Japan)
Seiya Miura, Canon Inc. (Japan)


Published in SPIE Proceedings Vol. 8683:
Optical Microlithography XXVI
Will Conley, Editor(s)

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