Share Email Print

Proceedings Paper

A study of vertical lithography for high-density 3D structures
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In recent years, demand for high-density integration of semiconductor chips has steadily increased due to miniaturization and high-performance requirements of electronics including Smartphones and Tablet PCs. In addition to 3D integration using Through-Silicon Via (TSV) technology, 2.5D integration technology using silicon interposers has also become a hot topic. Canon has identified key challenges that must be solved for successful implementation of high-density integration technologies into mass production and to meet these challenges, Canon developed the FPA-5510iV i-line lithography tool (stepper) that is now in wide use at customer sites for their most challenging processes. In this paper, Canon will explain details of FPA-5510iV features that support high-density integration. Canon will also introduce additional challenges that must be solved to ensure the success of high-density integration technologies in mass production, as well as Canon efforts to solve the remaining challenges.

Paper Details

Date Published: 12 April 2013
PDF: 9 pages
Proc. SPIE 8683, Optical Microlithography XXVI, 86831F (12 April 2013); doi: 10.1117/12.2011340
Show Author Affiliations
Masaki Mizutani, Canon Inc. (Japan)
Shin-Ichiro Hirai, Canon Inc. (Japan)
Ichiro Koizumi, Canon Inc. (Japan)
Ken-Ichiro Mori, Canon Inc. (Japan)
Seiya Miura, Canon Inc. (Japan)

Published in SPIE Proceedings Vol. 8683:
Optical Microlithography XXVI
Will Conley, Editor(s)

© SPIE. Terms of Use
Back to Top