Share Email Print
cover

Proceedings Paper

Dissipative particle dynamics study on directed self-assembly in holes
Author(s): T. Nakano; M. Matsukuma; K. Matsuzaki; M. Muramatsu; T. Tomita; T. Kitano
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We report morphology of cylinder of diblock copolymers (BCP), which consist of polymer A and B, in cylindrical prepattern holes by dissipative particle dynamics simulation in order to predict optimal cylinder profile. Configuration of cylinder which consists of polymer B changes along with change of affinity of underlayer and guide wall for BCP. In the case of underlayer, neutral to both the polymer species shows the most stable cylinder shape. When affinity converts to either polymer, cylinder shape gets distorted. In the case of intergrading guide wall condition from A wet to B wet for a certain hole CD, polymer B, that constitutes cylinder, gradually loosen and stack on the guide eventually. Moreover cylinder forms again for B wet larger hole. Free energy for hole CD is also investigated and the profile shows A wet wall and B wet wall are suitable for hole shrink in a narrow and wide range of hole CD, respectively. Because free energy of A wet wall varies widely for hole CD change. In contrast, free energy of B wet wall exhibits no significant changes and the profiles signify that cylinder shapes relatively stable in wider range than A wet wall.

Paper Details

Date Published: 26 March 2013
PDF: 6 pages
Proc. SPIE 8680, Alternative Lithographic Technologies V, 86801J (26 March 2013); doi: 10.1117/12.2011069
Show Author Affiliations
T. Nakano, Tokyo Electron Ltd. (Japan)
M. Matsukuma, Tokyo Electron Ltd. (Japan)
K. Matsuzaki, Tokyo Electron Ltd. (Japan)
M. Muramatsu, Tokyo Electron Kyushu Ltd. (Japan)
T. Tomita, Tokyo Electron Kyushu Ltd. (Japan)
T. Kitano, Tokyo Electron Kyushu Ltd. (Japan)


Published in SPIE Proceedings Vol. 8680:
Alternative Lithographic Technologies V
William M. Tong, Editor(s)

© SPIE. Terms of Use
Back to Top