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Proceedings Paper

ASML's NXE platform performance and volume introduction
Author(s): Rudy Peeters; Sjoerd Lok; Erwin van Alphen; Noreen Harned; Peter Kuerz; Martin Lowisch; Henk Meijer; David Ockwell; Eelco van Setten; Guido Schiffelers; Jan-Willem van der Horst; Judon Stoeldraijer; Robert Kazinczi; Richard Droste; Hans Meiling; Ron Kool
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Paper Abstract

All six NXE:3100, 0.25 NA EUV exposure systems are in use at customer sites enabling device development and cycles of learning for early production work in all lithographic segments; Logic, DRAM, MPU, and FLASH memory. NXE EUV lithography has demonstrated imaging and overlay performance both at ASML and end-users that supports sub- 27nm device work. Dedicated chuck overlay performance of <2nm has been shown on all six NXE:3100 systems. The key remaining challenge is productivity, which translates to a cost-effective introduction of EUVL in high-volume manufacturing (HVM). High volume manufacturing of the devices and processes in development is expected to be done with the third generation EUV scanners - the NXE:3300B. The NXE:3300B utilizes an NA of 0.33 and is positioned at a resolution of 22nm which can be extended to 18nm with off-axis illumination. The subsystem performance is improved to support these imaging resolutions and overall productivity enhancements are integrated into the NXE platform consistent with 125 wph. Since EUV reticles currently do not use a pellicle, special attention is given to reticle-addeddefects performance in terms of system design and machine build including maintenance procedures. In this paper we will summarize key lithographic performance of the NXE:3100 and the NXE:3300B, the NXE platform improvements made from learning on NXE:3100 and the Alpha Demo Tool, current status of EUV sources and development for the high-power sources needed for HVM. Finally, the possibilities for EUV roadmap extension will be reviewed.

Paper Details

Date Published: 1 April 2013
PDF: 15 pages
Proc. SPIE 8679, Extreme Ultraviolet (EUV) Lithography IV, 86791F (1 April 2013); doi: 10.1117/12.2010932
Show Author Affiliations
Rudy Peeters, ASML Netherlands B.V. (Netherlands)
Sjoerd Lok, ASML Netherlands B.V. (Netherlands)
Erwin van Alphen, ASML Netherlands B.V. (Netherlands)
Noreen Harned, ASML Netherlands B.V. (Netherlands)
Peter Kuerz, Carl Zeiss SMT AG (Germany)
Martin Lowisch, Carl Zeiss SMT AG (Germany)
Henk Meijer, ASML Netherlands B.V. (Netherlands)
David Ockwell, ASML Netherlands B.V. (Netherlands)
Eelco van Setten, ASML Netherlands B.V. (Netherlands)
Guido Schiffelers, ASML Netherlands B.V. (Netherlands)
Jan-Willem van der Horst, ASML Netherlands B.V. (Netherlands)
Judon Stoeldraijer, ASML Netherlands B.V. (Netherlands)
Robert Kazinczi, ASML Netherlands B.V. (Netherlands)
Richard Droste, ASML Netherlands B.V. (Netherlands)
Hans Meiling, ASML Netherlands B.V. (Netherlands)
Ron Kool, ASML Netherlands B.V. (Netherlands)

Published in SPIE Proceedings Vol. 8679:
Extreme Ultraviolet (EUV) Lithography IV
Patrick P. Naulleau, Editor(s)

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