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Proceedings Paper

Control of inspection for EUV substrates and mask blanks
Author(s): Milton Godwin; Teki Ranganath; Andy Ma
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Paper Abstract

Defect inspection of EUV substrates and mask blanks must be controlled consistently to ensure repeatable and accurate defect counts. Initial sensitivity must be maintained without producing false counts. Various constructed and native defect monitors are created on substrates to track inspection tool performance. Remedies are applied to an inspection tool when monitors go out of control.

Paper Details

Date Published: 18 April 2013
PDF: 9 pages
Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 868112 (18 April 2013); doi: 10.1117/12.2010819
Show Author Affiliations
Milton Godwin, SEMATECH (United States)
Teki Ranganath, SEMATECH (United States)
Andy Ma, SEMATECH (United States)


Published in SPIE Proceedings Vol. 8681:
Metrology, Inspection, and Process Control for Microlithography XXVII
Alexander Starikov; Jason P. Cain, Editor(s)

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