Share Email Print
cover

Proceedings Paper

Fast 3D thick mask model for full-chip EUVL simulations
Author(s): Peng Liu; Xiaobo Xie; Wei Liu; Keith Gronlund
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Extreme ultraviolet lithography (EUVL) uses a 13.5nm exposure wavelength, all-reflective projection optics, and a reflective mask under an oblique illumination with a chief ray angle of about 6 degrees to print device patterns. This imaging configuration leads to many challenges related to 3D mask topography. In order to accurately predict and correct these problems, it is important to use a 3D mask model in full-chip EUVL applications such as optical proximity correction (OPC) and verifications. In this work, a fast approximate 3D mask model developed previously for full-chip deep ultraviolet (DUV) applications is extended and greatly enhanced for EUV applications and its accuracy is evaluated against a rigorous 3D mask model.

Paper Details

Date Published: 1 April 2013
PDF: 16 pages
Proc. SPIE 8679, Extreme Ultraviolet (EUV) Lithography IV, 86790W (1 April 2013); doi: 10.1117/12.2010818
Show Author Affiliations
Peng Liu, ASML Brion Technologies (United States)
Xiaobo Xie, ASML Brion Technologies (United States)
Wei Liu, ASML Brion Technologies (United States)
Keith Gronlund, ASML Brion Technologies (United States)


Published in SPIE Proceedings Vol. 8679:
Extreme Ultraviolet (EUV) Lithography IV
Patrick P. Naulleau, Editor(s)

© SPIE. Terms of Use
Back to Top