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Packaging and integration of electronic microsystems: additive manufacturing for high mix, medium volume production
Author(s): Ben van der B. van der Zon; Jose M. Pozo
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Proc. SPIE 8614, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII, ; doi: 10.1117/12.2010522
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Ben van der B. van der Zon, TNO (Netherlands)
Jose M. Pozo, TNO (Netherlands)


Published in SPIE Proceedings Vol. 8614:
Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII
Rajeshuni Ramesham; Herbert R. Shea, Editor(s)

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