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Proceedings Paper

Nondestructive characterization of residual stress within CMOS-based composite microcantilevers
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Paper Abstract

Residual stress can affect the performance of thin-film micromachined structures and lead to curling in cantilevers as well as distortion in the frequency of resonant devices. As the origin of residual stress is dependent on the fabrication processes, a nondestructive method for characterization of residual stress independent of processes conditions is desirable for supporting the design of microcantilever-based microsystems. In this paper we present a nondestructive characterization of the residual stress within composite microcantilever beams providing valuable insights toward predicting their deflection profile after mechanical releasing from the substrate. The approach relies on the assumption of a linear gradient stress and a quadratic deflection profile across a composite microcantilever.

Paper Details

Date Published: 11 April 2013
PDF: 8 pages
Proc. SPIE 8694, Nondestructive Characterization for Composite Materials, Aerospace Engineering, Civil Infrastructure, and Homeland Security 2013, 869405 (11 April 2013); doi: 10.1117/12.2009903
Show Author Affiliations
Adrian A. Rendon-Hernandez, Tecnológico de Monterrey (Mexico)
Sergio Camacho-Leon, Tecnológico de Monterrey (Mexico)
Sergio O. Martinez-Chapa, Tecnológico de Monterrey (Mexico)


Published in SPIE Proceedings Vol. 8694:
Nondestructive Characterization for Composite Materials, Aerospace Engineering, Civil Infrastructure, and Homeland Security 2013
Tzu Yang Yu, Editor(s)

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