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Proceedings Paper

Visualization of thermally induced delamination by means of guided waves processing
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Paper Abstract

The aim of this paper is to present a method for visualization thermally induced delamination in composite material based on guided wave propagation phenomenon. Tested specimen was submitted to short time period high temperature source, which generated thermal degradation. In particular, delamination in material occurred. This procedure simulates some real case scenarios damage like one cased by atmospheric discharge striking wind turbine blade. Proposed method utilizes processing of full wavefield data acquired by the Scanning Doppler Laser Vibrometer. Registered wavefield images are transformed to wavenumber domain where the wave propagation pattern is removed. In this way after transformation signal back to space domain it contains only information about changes in wave propagation and may be used for damage visualization. However, attenuation of waves cause that visualized anomalies has lower amplitudes with increased distance from the actuator. The proposed enhancement of signal processing algorithm enables quantification of the size of the damage. The enhancement is a technique for compensation of the wave attenuation so that the effects of structural damages have the same influence regardless of the location.

Paper Details

Date Published: 19 April 2013
PDF: 10 pages
Proc. SPIE 8692, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2013, 86921O (19 April 2013); doi: 10.1117/12.2009633
Show Author Affiliations
Maciej Radzienski, The Szewalski Institute of Fluid-Flow Machinery (Poland)
Gdansk Univ. of Technology (Poland)
Pawel Kudela, The Szewalski Institute of Fluid-Flow Machinery (Poland)
Wieslaw Ostachowicz, The Szewalski Institute of Fluid-Flow Machinery (Poland)
Warsaw Univ. of Technology (Poland)


Published in SPIE Proceedings Vol. 8692:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2013
Jerome Peter Lynch; Chung-Bang Yun; Kon-Well Wang, Editor(s)

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