Share Email Print
cover

Proceedings Paper

Integrated high speed hybrid silicon transmitter
Author(s): Siddharth R. Jain; Yongbo Tang; Sudharsanan Srinivasan; Martijn J. R. Heck; John E. Bowers
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We review recent progress made on the hybrid silicon platform towards realizing an integrated high speed WDM transmitter on silicon. Using ion implantation enhanced quantum well intermixing, four band gaps are integrated on a single chip and used to demonstrate a DFB laser array operating over 200 nm from 1250 to 1450 nm. Results from an independent effort to improve on hybrid silicon EA modulator performance are also described. Together these demonstrations pave the way to realize a terabit transmitter on silicon.

Paper Details

Date Published: 27 February 2013
PDF: 9 pages
Proc. SPIE 8630, Optoelectronic Interconnects XIII, 863016 (27 February 2013); doi: 10.1117/12.2009454
Show Author Affiliations
Siddharth R. Jain, Univ. of California, Santa Barbara (United States)
Yongbo Tang, Univ. of California, Santa Barbara (United States)
Sudharsanan Srinivasan, Univ. of California, Santa Barbara (United States)
Martijn J. R. Heck, Univ. of California, Santa Barbara (United States)
John E. Bowers, Univ. of California, Santa Barbara (United States)


Published in SPIE Proceedings Vol. 8630:
Optoelectronic Interconnects XIII
Alexei L. Glebov; Ray T. Chen, Editor(s)

© SPIE. Terms of Use
Back to Top