Share Email Print
cover

Proceedings Paper

Optical transceivers for interconnections in satellite payloads
Author(s): Mikko Karppinen; Veli Heikkinen; Eveliina Juntunen; Kari Kautio; Jyrki Ollila; Aila Sitomaniemi; Antti Tanskanen
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The increasing data rates and processing on board satellites call for the use of photonic interconnects providing high-bitrate performance as well as valuable savings in mass and volume. Therefore, optical transmitter and receiver technology is developed for aerospace applications. The metal-ceramic-packaging with hermetic fiber pigtails enables robustness for the harsh spacecraft environment, while the 850-nm VCSEL-based transceiver technology meets the high bit-rate and low power requirements. The developed components include 6 Gbps SpaceFibre duplex transceivers for intra-satellite data links and 40 Gbps parallel optical transceivers for board-to-board interconnects. Also, integration concept of interchip optical interconnects for onboard processor ICs is presented.

Paper Details

Date Published: 27 February 2013
PDF: 7 pages
Proc. SPIE 8630, Optoelectronic Interconnects XIII, 86300F (27 February 2013); doi: 10.1117/12.2009092
Show Author Affiliations
Mikko Karppinen, VTT Technical Research Ctr. of Finland (Finland)
Veli Heikkinen, VTT Technical Research Ctr. of Finland (Finland)
Eveliina Juntunen, VTT Technical Research Ctr. of Finland (Finland)
Kari Kautio, VTT Technical Research Ctr. of Finland (Finland)
Jyrki Ollila, VTT Technical Research Ctr. of Finland (Finland)
Aila Sitomaniemi, VTT Technical Research Ctr. of Finland (Finland)
Antti Tanskanen, VTT Technical Research Ctr. of Finland (Finland)


Published in SPIE Proceedings Vol. 8630:
Optoelectronic Interconnects XIII
Alexei L. Glebov; Ray T. Chen, Editor(s)

© SPIE. Terms of Use
Back to Top