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Proceedings Paper

Chemical amplification negative resist systems composed of novolac, silanols, and acid generators
Author(s): Takumi Ueno; Hiroshi Shiraishi; Nobuaki Hayashi; Keiko Tadano; Emiko Fukuma; Takao Iwayanagi
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Paper Abstract

Negative chemical amplification resist systems composed of Novolak resin, a silanol compound, and an acid generator are investigated as deep UV resists. The acid produced in the exposed area induces the condensation reaction of silanol compounds during post-exposure baking. The condensation reaction products, siloxanes, act as an aqueous-base dissolution inhibitor, while silanol compounds in unexposed area work as aqueous base dissolution promoters. The resist composed of Novolak resin, diphenylsilanediol, and triphenylsulfonium triflate shows quite high sensitivity (-.-lmJ/cm2). Using this resist, O.3pm line-and-space patterns were obtained by KrF excimer laser stepper with 3mJ/cm2 dose.

Paper Details

Date Published: 1 June 1990
PDF: 6 pages
Proc. SPIE 1262, Advances in Resist Technology and Processing VII, (1 June 1990); doi: 10.1117/12.20085
Show Author Affiliations
Takumi Ueno, Hitachi, Ltd. (Japan)
Hiroshi Shiraishi, Hitachi, Ltd. (Japan)
Nobuaki Hayashi, Hitachi, Ltd. (Japan)
Keiko Tadano, Hitachi, Ltd. (Japan)
Emiko Fukuma, Hitachi, Ltd. (Japan)
Takao Iwayanagi, Hitachi, Ltd. (Japan)

Published in SPIE Proceedings Vol. 1262:
Advances in Resist Technology and Processing VII
Michael P. C. Watts, Editor(s)

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