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Proceedings Paper

3D lithography for implant applications
Author(s): Jens Schneider; Henning Feick; Dieter Kaiser; Marcel Heller; Daniel Sarlette
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Paper Abstract

In this paper we describe an approach for the realization of 3D resist patterns for implant applications, highlighting the opportunities of controlling doping depth and profiles and their influence on device parameters. We choose a grayscale litho process, where the 3D structuring of the photoresist is done by a spatially variable exposure. Pixilated grayscale mask structures are defined to achieve the desired 3D resist patterns by locally variable transmittance values. The variable transmittance values result in different resist film thicknesses after development. Up to 20 different resist film thicknesses are obtained within a single exposure shot. This enables spatial patterning of the implant depth and accordingly various novel approaches for device optimization.

Paper Details

Date Published: 29 March 2013
PDF: 7 pages
Proc. SPIE 8683, Optical Microlithography XXVI, 86831P (29 March 2013); doi: 10.1117/12.2008444
Show Author Affiliations
Jens Schneider, Infineon Technologies Dresden GmbH (Germany)
Henning Feick, Infineon Technologies Dresden GmbH (Germany)
Dieter Kaiser, Infineon Technologies Dresden GmbH (Germany)
Marcel Heller, Infineon Technologies Dresden GmbH (Germany)
Daniel Sarlette, Infineon Technologies Dresden GmbH (Germany)


Published in SPIE Proceedings Vol. 8683:
Optical Microlithography XXVI
Will Conley, Editor(s)

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