Share Email Print
cover

Proceedings Paper

High speed micro scanner for 3D in-volume laser micro processing
Author(s): D. Schaefer; J. Gottmann; M. Hermans; J. Ortmann; I. Kelbassa
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Using an in-house developed micro scanner three-dimensional micro components and micro fluidic devices in fused silica are realized using the ISLE process (in-volume selective laser-induced etching). With the micro scanner system the potential of high average power femtosecond lasers (P > 100 W) is exploited by the fabrication of components with micrometer precision at scan speeds of several meters per second. A commercially available galvanometer scanner is combined with an acousto-optical and/or electro-optical beam deflector and translation stages. For focusing laser radiation high numerical aperture microscope objectives (NA > 0.3) are used generating a focal volume of a few cubic micrometers. After laser exposure the materials are chemically wet etched in aqueous solution. The laser-exposed material is etched whereas the unexposed material remains nearly unchanged. Using the described technique called ISLE the fabrication of three-dimensional micro components, micro holes, cuts and channels is possible with high average power femtosecond lasers resulting in a reduced processing time for exposure. By developing the high speed micro scanner up-scaling of the ISLE process is demonstrated. The fabricated components made out of glass can be applied in various markets like biological and medical diagnostics as well as in micro mechanics.

Paper Details

Date Published: 15 March 2013
PDF: 6 pages
Proc. SPIE 8608, Laser-based Micro- and Nanopackaging and Assembly VII, 860808 (15 March 2013); doi: 10.1117/12.2008205
Show Author Affiliations
D. Schaefer, RWTH Aachen (Germany)
J. Gottmann, RWTH Aachen (Germany)
M. Hermans, RWTH Aachen (Germany)
J. Ortmann, RWTH Aachen (Germany)
I. Kelbassa, RWTH Aachen (Germany)


Published in SPIE Proceedings Vol. 8608:
Laser-based Micro- and Nanopackaging and Assembly VII
Udo Klotzbach; Yongfeng Lu; Kunihiko Washio, Editor(s)

© SPIE. Terms of Use
Back to Top