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Proceedings Paper

Increasing the dimensions of metrology
Author(s): Wilhelm Maurer; Carola Blaesing-Bangert; Hans-Helmut Paul
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Paper Abstract

In any process that generates or measures pattern-placement (overlay), these parameters need to be regarded at least as two-dimensional. We show this on our procedure bringing a mask repeater under statistical process control SPC). In order to increase the accuracy of the overlay measurement process itself, plate bending has to be included as a third dimension. By taking the third dimension into account, the LMS 2000 Metrology System significantly reduces the maximum uncertainity of measurement results.

Paper Details

Date Published: 1 June 1990
PDF: 9 pages
Proc. SPIE 1261, Integrated Circuit Metrology, Inspection, and Process Control IV, (1 June 1990); doi: 10.1117/12.20071
Show Author Affiliations
Wilhelm Maurer, Siemens AG (United States)
Carola Blaesing-Bangert, Wild Leitz GmbH (Germany)
Hans-Helmut Paul, Wild Leitz GmbH (Germany)


Published in SPIE Proceedings Vol. 1261:
Integrated Circuit Metrology, Inspection, and Process Control IV
William H. Arnold, Editor(s)

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