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Proceedings Paper

2D capacitive micromachined ultrasound transducer using novel tiling based on silicon frame
Author(s): Youngil Kim; Kyungil Cho; Baehyung Kim; Seungheun Lee; Taeho Jeon; Jongkeun Song
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Paper Abstract

In this study, we showed the new transducer and probe integration of 2D ultrasound probe using cMUT. cMUT ultrasound probe having 8192 elements is assembled with tiling frame. Flip chip bonded cMUT-ASIC tiles were arrayed along 2×8 directions to enlarge lateral aperture. Tiling gap between two tiles was under 100μm. RTV layer that has 1mm thick is used in 2-D probe system as a lens and protection layer. Thermal module is also analyzed by using the thermal network analysis, which is realized with the air fans and the fins. Designed PCB circuit for tiling module which is considered with cooling spread concept is 5cm × 5cm dimension. Uniformity and performance of tiled ultrasound transducer were tested under soybean oil at 3MHz frequency successfully. The measured 256 elements distribution has only 4.45% deviation. If we can remove the side edge error, the deviation will be under 3%. The performance after RTV lensing showed 35% attenuation in Tx and 35~45% attenuation in Rx.

Paper Details

Date Published: 29 March 2013
PDF: 7 pages
Proc. SPIE 8675, Medical Imaging 2013: Ultrasonic Imaging, Tomography, and Therapy, 86750E (29 March 2013); doi: 10.1117/12.2006140
Show Author Affiliations
Youngil Kim, Samsung Advanced Institute of Technology (Korea, Republic of)
Kyungil Cho, Samsung Advanced Institute of Technology (Korea, Republic of)
Baehyung Kim, Samsung Advanced Institute of Technology (Korea, Republic of)
Seungheun Lee, Samsung Advanced Institute of Technology (Korea, Republic of)
Taeho Jeon, Samsung Advanced Institute of Technology (Korea, Republic of)
Jongkeun Song, Samsung Advanced Institute of Technology (Korea, Republic of)


Published in SPIE Proceedings Vol. 8675:
Medical Imaging 2013: Ultrasonic Imaging, Tomography, and Therapy
Johan G. Bosch; Marvin M. Doyley, Editor(s)

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