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Proceedings Paper

Study of swelling behavior in ArF resist during development by the QCM method (3): observations of swelling layer elastic modulus
Author(s): Atsushi Sekiguchi
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Paper Abstract

The QCM method allows measurements of impedance, an index of swelling layer viscosity in a photoresist during development. While impedance is sometimes used as a qualitative index of change in the viscosity of the swelling layer, it has to date not been used quantitatively, for data analysis. We explored a method for converting impedance values to elastic modulus (Pa), a coefficient expressing viscosity. Applying this method, we compared changes in the viscosity of the swelling layer in an ArF resist generated during development in a TMAH developing solution and in a TBAH developing solution. This paper reports the results of this comparative study.

Paper Details

Date Published: 29 March 2013
PDF: 12 pages
Proc. SPIE 8682, Advances in Resist Materials and Processing Technology XXX, 86821L (29 March 2013); doi: 10.1117/12.2006027
Show Author Affiliations
Atsushi Sekiguchi, Litho Tech Japan Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 8682:
Advances in Resist Materials and Processing Technology XXX
Mark H. Somervell, Editor(s)

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