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Proceedings Paper

Evaluation of a compound eye type tactile endoscope
Author(s): Kayo Yoshimoto; Kenji Yamada; Nagisa Sasaki; Maki Takeda; Sachiko Shimizu; Toshiaki Nagakura; Hideya Takahashi; Yuko Ohno
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Paper Abstract

Minimally invasive surgical techniques for endoscope become widely used, for example, laparoscopic operation, NOTES (Natural Orifice Translumenal Endoscopic Surgery), robotic surgery and so on. There are so many demand and needs for endoscopic diagnosis. Especially, palpation is most important diagnosis on any surgery. However, conventional endoscopic system has no tactile sensibility. There are many studies about tactile sensor for medical application. These sensors can measure object at a point. It is necessary to sense in areas for palpation. To overcome this problem, we propose compound eye type tactile endoscope. The proposed system consists of TOMBO (Thin Observation Module by Bound Optics) and clear silicon rubber. Our proposed system can estimate hardness of target object by measuring deformation of a projected pattern on the silicon rubber. The purpose of this study is to evaluate the proposed system. At first, we introduce approximated models of the silicone and the object. We formulate the stiffness of object, the deformation of silicone, and the whole object. We investigate the accuracy of measured silicone’s lower surface for deformation of silicone by prototype system. Finally, we evaluate the calculated stiffness of the soft object.

Paper Details

Date Published: 13 March 2013
PDF: 6 pages
Proc. SPIE 8575, Endoscopic Microscopy VIII, 85750Z (13 March 2013); doi: 10.1117/12.2005808
Show Author Affiliations
Kayo Yoshimoto, Osaka Univ. (Japan)
Kenji Yamada, Osaka Univ. (Japan)
Nagisa Sasaki, Osaka Univ. (Japan)
Maki Takeda, Osaka Univ. (Japan)
Sachiko Shimizu, Osaka Univ. (Japan)
Toshiaki Nagakura, Osaka Electro-Communication Univ. (Japan)
Hideya Takahashi, Osaka City Univ. (Japan)
Yuko Ohno, Osaka Univ. (Japan)


Published in SPIE Proceedings Vol. 8575:
Endoscopic Microscopy VIII
Guillermo J. Tearney; Thomas Duen-Shyr Wang, Editor(s)

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