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Proceedings Paper

Silicon backside machining using a nanosecond 2-μm Tm:fiber laser
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Paper Abstract

Utilizing the transparency of silicon at 2 μm, we are able to ablate the backside of 500-μm thick silicon wafers without causing any damage to the front surface using a novel nanosecond Tm:fiber laser system. We report on our high energy/high peak power nanosecond Tm:fiber laser and provide an initial description of the effects of laser parameters such as pulse duration and energy density on the ablation, and compare thresholds for front and backside machining. The ability to selectively machine the backside of silicon wafers without disturbing the front surface may lead to new processing techniques for advanced manufacturing in solar cell and microelectronics industries.

Paper Details

Date Published: 9 March 2013
PDF: 6 pages
Proc. SPIE 8612, Micromachining and Microfabrication Process Technology XVIII, 861207 (9 March 2013); doi: 10.1117/12.2004878
Show Author Affiliations
Lawrence Shah, CREOL, The College of Optics and Photonics, Univ. of Central Florida (United States)
Tobias Bonhoff, Fraunhofer Institute for Laser Technology (Germany)
Thomas Ferhat, Rofin-Baasel France S.A. (France)
Ashraf F. El-Sherif, Military Technical College (Egypt)
Mark Ramme, CREOL, The College of Optics and Photonics, Univ. of Central Florida (United States)
Christina C. C. Willis, CREOL, The College of Optics and Photonics, Univ. of Central Florida (United States)
Matthieu Baudelet, CREOL, The College of Optics and Photonics, Univ. of Central Florida (United States)
Pankaj Kadwani, CREOL, The College of Optics and Photonics, Univ. of Central Florida (United States)
Christian Gaida, CREOL, The College of Optics and Photonics, Univ. of Central Florida (United States)
Friedrich-Schiller-Univ. Jena (Germany)
Martin Gebhardt, CREOL, The College of Optics and Photonics, Univ. of Central Florida (United States)
Friedrich-Schiller-Univ. Jena (Germany)
Ilya Mingareev, CREOL, The College of Optics and Photonics, Univ. of Central Florida (United States)
Fraunhofer Institute for Laser Technology (Germany)
Martin Richardson, CREOL, The College of Optics and Photonics, Univ. of Central Florida (United States)


Published in SPIE Proceedings Vol. 8612:
Micromachining and Microfabrication Process Technology XVIII
Mary Ann Maher; Paul J. Resnick, Editor(s)

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